INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "PACKAGE COMPRISING A PACKAGE INTERPOSER AND A LID FRAME WITH AN OPENING"

GENEVA, Jan. 6 -- QUALCOMM INCORPORATED (Attn: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/033209) for "PACKAGE COMPRISING A PACKAGE INTERPOSER AND A LID FRAME WITH AN OPENING" on Jun 11, 2025. With publication no. WO/2026/006000, the details related to the patent application was published on Jan 02, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SONG, Yanmei (5775 Morehouse DriveSan Diego, California 92121-1714), HUANG, Jingyi (5775 Morehouse DriveSan Diego, California 92121-1714), YUN, Sun Woong (5775 Morehous...