INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "MULTIPLE CONCATENATION BUFFERS AT A PACKET DATA CONVERGENCE PROTOCOL LAYER"

GENEVA, June 25 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, CA 92121-1714) filed a patent application (PCT/US2024/058249) for "MULTIPLE CONCATENATION BUFFERS AT A PACKET DATA CONVERGENCE PROTOCOL LAYER" on Dec 03, 2024. With publication no. WO/2025/128362, the details related to the patent application was published on Jun 19, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): ELAZZOUNI, Sherif (5775 Morehouse DriveSan Diego, CA 92121-1714), OZTURK, Ozcan (5775 Morehouse DriveSan Diego, CA 92121-1714), HORN, Gavin, Bernard (5775 Morehouse DriveSa...