INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "MULTILAYER CORELESS SUBSTRATE FORMED FROM STACKED EMBEDDED TRACE SUBSTRATES"

GENEVA, July 21 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2024/061527) for "MULTILAYER CORELESS SUBSTRATE FORMED FROM STACKED EMBEDDED TRACE SUBSTRATES" on Dec 20, 2024. With publication no. WO/2025/151282, the details related to the patent application was published on Jul 17, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KANG, Kyudong (QUALCOMM Incorporated5775 Morehouse DriveSan Diego, California 92121-1714), SHIN, Heun Gun (QUALCOMM Incorporated5775 Morehouse DriveSan Diego, Cali...