INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "MULTI-SIDED MILLIMETER WAVE ANTENNA ARRAY MODULE AND ASSOCIATED RADIO FREQUENCY (RF) INTEGRATED CIRCUIT (IC) BUMP PLACEMENT"

GENEVA, Oct. 1 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/019840) for "MULTI-SIDED MILLIMETER WAVE ANTENNA ARRAY MODULE AND ASSOCIATED RADIO FREQUENCY (RF) INTEGRATED CIRCUIT (IC) BUMP PLACEMENT" on Mar 13, 2025. With publication no. WO/2025/198941, the details related to the patent application was published on Sep 25, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): RAGHAVAN, Vasanthan (5775 Morehouse DriveSan Diego, California 92121), TASSOUDJI, Mohammad Ali (5775 Morehouse Drive...