INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "LOW-FOOTPRINT MODEL BASED ON SOFTMAX WITH NORM FOLDING FOR OPTICAL FLOW ESTIMATION AND STEREO MATCHING"

GENEVA, Sept. 2 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/013518) for "LOW-FOOTPRINT MODEL BASED ON SOFTMAX WITH NORM FOLDING FOR OPTICAL FLOW ESTIMATION AND STEREO MATCHING" on Jan 29, 2025. With publication no. WO/2025/178733, the details related to the patent application was published on Aug 28, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): LIN, Jamie Menjay (5775 Morehouse DriveSan Diego, California 92121), JEONG, Jisoo (5775 Morehouse DriveSan Diego, California 92121), CAI...