INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "INTERPOSER CONNECTION STRUCTURES BASED ON WIRE BONDING"

GENEVA, April 21 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2024/048389) for "INTERPOSER CONNECTION STRUCTURES BASED ON WIRE BONDING" on Sep 25, 2024. With publication no. WO/2025/080418, the details related to the patent application was published on Apr 17, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): ALDRETE, Manuel (QUALCOMM Incorporated5775 Morehouse DriveSan Diego, California 92121-1714), KUMAR, Rajneesh (QUALCOMM Incorporated5775 Morehouse DriveSan Diego, California 92121-1714...