INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "INTERCONNECTS BETWEEN CHIPLETS AND RELATED LINK INITIALIZATION PROTOCOLS"

GENEVA, March 18 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2024/036030) for "INTERCONNECTS BETWEEN CHIPLETS AND RELATED LINK INITIALIZATION PROTOCOLS" on Jun 28, 2024. With publication no. WO/2025/053895, the details related to the patent application was published on Mar 13, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): AKAVARAM, Santhosh Reddy (5775 Morehouse DriveSan Diego, California 92121), SRIVASTAVA, Prakhar (5775 Morehouse DriveSan Diego, California 92121), PATEL, Aditya Sing...