INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "INTERCONNECT INCLUDING CONDUCTOR IN PHOTO-IMAGEABLE DIELECTRIC LAYER"

GENEVA, Oct. 20 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/018552) for "INTERCONNECT INCLUDING CONDUCTOR IN PHOTO-IMAGEABLE DIELECTRIC LAYER" on Mar 05, 2025. With publication no. WO/2025/216818, the details related to the patent application was published on Oct 16, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SHIN, Heun Gun (5775 Morehouse DriveSan Diego, California 92121)

Abstract: A device includes a substrate that includes a photo-imageable dielectric (PID) layer having a ...