INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "INTEGRATED DEVICE WITH CONDUCTIVE PILLAR STRUCTURE FOR DIE INTERCONNECTION"

GENEVA, Sept. 30 -- QUALCOMM INCORPORATED (Attn: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/018207) for "INTEGRATED DEVICE WITH CONDUCTIVE PILLAR STRUCTURE FOR DIE INTERCONNECTION" on Mar 03, 2025. With publication no. WO/2025/198836, the details related to the patent application was published on Sep 25, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): WE, Hong Bok (5775 Morehouse DriveSan Diego, California 92121), BUOT, Joan Rey Villarba (5775 Morehouse DriveSan Diego, California 92121), KANG, Kuiwon (5775 Moreh...