INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "INTEGRATED DEVICE INCLUDING DIRECT MEMORY ATTACHMENT ON THROUGH MOLD CONDUCTORS"

GENEVA, Feb. 11 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2024/032839) for "INTEGRATED DEVICE INCLUDING DIRECT MEMORY ATTACHMENT ON THROUGH MOLD CONDUCTORS" on Jun 06, 2024. With publication no. WO/2025/029378, the details related to the patent application was published on Feb 06, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): WANG, Zhijie (5775 Morehouse DriveSan Diego, California 92121), KUMAR, Rajneesh (5775 Morehouse DriveSan Diego, California 92121), ALDRETE, Manuel (5775 Moreho...