INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "INTEGRATED DEVICE COMPRISING A PILLAR SHELL INTERCONNECT AND AN INNER SOLDER INTERCONNECT"

GENEVA, March 25 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2024/044426) for "INTEGRATED DEVICE COMPRISING A PILLAR SHELL INTERCONNECT AND AN INNER SOLDER INTERCONNECT" on Aug 29, 2024. With publication no. WO/2025/058858, the details related to the patent application was published on Mar 20, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): CHEN, Yujen (5775 Morehouse DriveSan Diego, California 92121-1714), SUN, Yangyang (5775 Morehouse DriveSan Diego, California 92121-1714), WANG, Wei ...