INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "INTEGRATED CIRCUITS WITH TWO-SIDE METALLIZATION AND EXTERNAL STIFFENING LAYER AND RELATED FABRICATION METHODS"

GENEVA, March 18 -- QUALCOMM INCORPORATED (Attn: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2024/040912) for "INTEGRATED CIRCUITS WITH TWO-SIDE METALLIZATION AND EXTERNAL STIFFENING LAYER AND RELATED FABRICATION METHODS" on Aug 05, 2024. With publication no. WO/2025/053929, the details related to the patent application was published on Mar 13, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): LI, Xia (5775 Morehouse DriveSan Diego, California 92121), KIM, Jonghae (5775 Morehouse DriveSan Diego, California 92121), YANG,...