INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "INTEGRATED CIRCUIT PACKAGE WITH DIE INTERCONNECTS TERMINATING AT MULTIPLE METALLIZATION LAYERS IN A SUBSTRATE"

GENEVA, Aug. 12 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/011636) for "INTEGRATED CIRCUIT PACKAGE WITH DIE INTERCONNECTS TERMINATING AT MULTIPLE METALLIZATION LAYERS IN A SUBSTRATE" on Jan 15, 2025. With publication no. WO/2025/165572, the details related to the patent application was published on Aug 07, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): PATIL, Aniket (5775 Morehouse DriveSan Diego, California 92121), SUN, Yangyang (5775 Morehouse DriveSan Diego, California 92121),...