INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "INTEGRATED CIRCUIT PACKAGE COMPRISING A SUBSTRATE AND A SOLDER JOINT COUPLED TO A CORNER INTERCONNECT STRUCTURE OF THE SUBSTRATE TO IMPROVE THE RELIABILITY OF THE PACKAGE"

GENEVA, Dec. 16 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/030545) for "INTEGRATED CIRCUIT PACKAGE COMPRISING A SUBSTRATE AND A SOLDER JOINT COUPLED TO A CORNER INTERCONNECT STRUCTURE OF THE SUBSTRATE TO IMPROVE THE RELIABILITY OF THE PACKAGE" on May 22, 2025. With publication no. WO/2025/254837, the details related to the patent application was published on Dec 11, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): PATIL, Aniket (5775 Morehouse DriveSan Diego, California 92121), ROG...