INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "INTEGRATED CIRCUIT DEVICE INCLUDING THERMAL INTERPOSER LAYER"

GENEVA, June 24 -- QUALCOMM INCORPORATED (5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2024/056670) for "INTEGRATED CIRCUIT DEVICE INCLUDING THERMAL INTERPOSER LAYER" on Nov 20, 2024. With publication no. WO/2025/128296, the details related to the patent application was published on Jun 19, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): LAN, Je-Hsiung (5775 Morehouse DriveSan Diego, California 92121), KIM, Jonghae (5775 Morehouse DriveSan Diego, California 92121), DUTTA, Ranadeep (5775 Morehouse DriveSan Diego, California 92121)

Abstract: A devi...