INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "INTEGRATED CIRCUIT DEVICE HAVING A SUBSTRATE WITH A STEPPED CONFIGURATION TO ACCOMMODATE AT LEAST TWO DIFFERENT SOLDER BALL SIZES"

GENEVA, March 10 -- QUALCOMM INCORPORATED (Attn: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2024/037885) for "INTEGRATED CIRCUIT DEVICE HAVING A SUBSTRATE WITH A STEPPED CONFIGURATION TO ACCOMMODATE AT LEAST TWO DIFFERENT SOLDER BALL SIZES" on Jul 12, 2024. With publication no. WO/2025/048966, the details related to the patent application was published on Mar 06, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): PATIL, Aniket (5775 Morehouse DriveSan Diego, California 92121), ALDRETE, Manuel (5775 Morehouse DriveSan Di...