INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "INTEGRATED CIRCUIT (IC) PACKAGE INCLUDING TWO SUBSTRATES AND VERTICAL INTERCONNECTS COUPLING THE TWO SUBSTRATES, THE VERTICAL INTERCONNECTS COMPRISING A METAL BALL AND METAL PIN COMBINATION TO ADDRESS AN INCREASED DISTANCE BETWEEN SUBSTRATES"

GENEVA, Oct. 20 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/021985) for "INTEGRATED CIRCUIT (IC) PACKAGE INCLUDING TWO SUBSTRATES AND VERTICAL INTERCONNECTS COUPLING THE TWO SUBSTRATES, THE VERTICAL INTERCONNECTS COMPRISING A METAL BALL AND METAL PIN COMBINATION TO ADDRESS AN INCREASED DISTANCE BETWEEN SUBSTRATES" on Mar 28, 2025. With publication no. WO/2025/216893, the details related to the patent application was published on Oct 16, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s...