INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "INTEGRATED CIRCUIT (IC) PACKAGE HAVING A SUBSTRATE EMPLOYING REDUCED AREA, ADDED METAL PAD(S) TO METAL INTERCONNECT(S) TO REDUCE DIE-SUBSTRATE CLEARANCE"

GENEVA, June 18 -- QUALCOMM INCORPORATED (Attn: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2024/057007) for "INTEGRATED CIRCUIT (IC) PACKAGE HAVING A SUBSTRATE EMPLOYING REDUCED AREA, ADDED METAL PAD(S) TO METAL INTERCONNECT(S) TO REDUCE DIE-SUBSTRATE CLEARANCE" on Nov 22, 2024. With publication no. WO/2025/122365, the details related to the patent application was published on Jun 12, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): ALAWANI, Ashish (5775 Morehouse DriveSan Diego, California 92121), AGARWAL, Abhishek S...