INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "HEAT-DISSIPATION STRUCTURES INCLUDING RADIAL FINS"

GENEVA, Nov. 18 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/026341) for "HEAT-DISSIPATION STRUCTURES INCLUDING RADIAL FINS" on Apr 25, 2025. With publication no. WO/2025/235233, the details related to the patent application was published on Nov 13, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): GOPU, Dhinesh Jambai (5775 Morehouse DriveSan Diego, California 92121), MATTIS, Eric (5775 Morehouse DriveSan Diego, California 92121), SARKAR, Shibsankar (5775 Morehouse DriveSan Diego, Ca...