INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "DUAL-LINER THROUGH-SILICON VIA (TSV) FOR POWER AND SIGNAL TRANSMISSION"

GENEVA, Dec. 31 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/027619) for "DUAL-LINER THROUGH-SILICON VIA (TSV) FOR POWER AND SIGNAL TRANSMISSION" on May 02, 2025. With publication no. WO/2025/264318, the details related to the patent application was published on Dec 26, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): BADAROGLU, Mustafa (5775 Morehouse DriveSan Diego, California 92121-1714), WANG, Zhongze (5775 Morehouse DriveSan Diego, California 92121-1714), KANG, Woo Tag (5775 Mor...