INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "DEVICES INCLUDING ONE OR MORE HIGH-IMPEDANCE LAYERS BETWEEN A DISPLAY STACK AND AN ULTRASONIC FINGERPRINT SENSOR STACK"

GENEVA, Aug. 5 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2024/058533) for "DEVICES INCLUDING ONE OR MORE HIGH-IMPEDANCE LAYERS BETWEEN A DISPLAY STACK AND AN ULTRASONIC FINGERPRINT SENSOR STACK" on Dec 04, 2024. With publication no. WO/2025/159839, the details related to the patent application was published on Jul 31, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): STROHMANN, Jessica Liu (c/o QUALCOMM Incorporated5775 Morehouse DriveSan Diego, California 92121-1714), LIN, Shiang-Chi (...