INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "DEVICE WITH SIDE-BY-SIDE INTEGRATED CIRCUIT DEVICES"

GENEVA, April 30 -- QUALCOMM INCORPORATED (Attn: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2024/046121) for "DEVICE WITH SIDE-BY-SIDE INTEGRATED CIRCUIT DEVICES" on Sep 11, 2024. With publication no. WO/2025/085183, the details related to the patent application was published on Apr 24, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): PATIL, Aniket (5775 Morehouse DriveSan Diego, California 92121), BUOT, Joan Rey Villarba (5775 Morehouse DriveSan Diego, California 92121)

Abstract: A device includes a substrate that...