INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "CONDUCTIVE STRUCTURE AND INTERCONNECTS FOR ELECTRICALLY CONNECTING A SUBSTRATE AND AN INTERPOSER"

GENEVA, Dec. 16 -- QUALCOMM INCORPORATED (Attn: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/025909) for "CONDUCTIVE STRUCTURE AND INTERCONNECTS FOR ELECTRICALLY CONNECTING A SUBSTRATE AND AN INTERPOSER" on Apr 23, 2025. With publication no. WO/2025/254742, the details related to the patent application was published on Dec 11, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): PATIL, Aniket (5775 Morehouse DriveSan Diego, California 92121), WANG, Zhijie (5775 Morehouse DriveSan Diego, California 92121), BUOT, Joan Re...