INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "CONDUCTIVE PASTE VSS SHORTING FOR GROUND BUMPS"

GENEVA, Oct. 28 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/023040) for "CONDUCTIVE PASTE VSS SHORTING FOR GROUND BUMPS" on Apr 03, 2025. With publication no. WO/2025/221471, the details related to the patent application was published on Oct 23, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): PATIL, Aniket (QUALCOMM Incorporated5775 Morehouse DriveSan Diego, California 92121-1714), CHEN, Yujen (QUALCOMM Incorporated5775 Morehouse DriveSan Diego, California 92121-1714), WANG, Zhijie...