INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "BRIDGE DIE IN SUBSTRATE CORE LAYER"

GENEVA, June 12 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2024/055374) for "BRIDGE DIE IN SUBSTRATE CORE LAYER" on Nov 11, 2024. With publication no. WO/2025/117170, the details related to the patent application was published on Jun 05, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): BUOT, Joan Rey Villarba (5775 Morehouse DriveSan Diego, California 92121), WE, Hong Bok (5775 Morehouse DriveSan Diego, California 92121), WANG, Zhijie (5775 Morehouse DriveSan Diego, California 92121), L...