INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "BANDWIDTH PART CONFIGURATION FOR FULL-DUPLEX COMMUNICATIONS"

GENEVA, Oct. 1 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/019043) for "BANDWIDTH PART CONFIGURATION FOR FULL-DUPLEX COMMUNICATIONS" on Mar 07, 2025. With publication no. WO/2025/198879, the details related to the patent application was published on Sep 25, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): ABOTABL, Ahmed, Attia (5775 Morehouse DriveSan Diego, California 92121-1714), ABDELGHAFFAR, Muhammad, Sayed, Khairy (5775 Morehouse DriveSan Diego, California 92121-1714), IBRAHIM,...