INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "ARCHITECTURE FOR OPTIMIZING A BOOT-UP PROCESS OF AN INTEGRATED CIRCUIT DEVICE INCLUDING MULTIPLE CHIPLETS"

GENEVA, Feb. 18 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2024/032972) for "ARCHITECTURE FOR OPTIMIZING A BOOT-UP PROCESS OF AN INTEGRATED CIRCUIT DEVICE INCLUDING MULTIPLE CHIPLETS" on Jun 07, 2024. With publication no. WO/2025/034298, the details related to the patent application was published on Feb 13, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): RAGHURAMAN, Praveen (5775 Morehouse DriveSan Diego, California 92121), SRINIVASAN, Dharani Kumar (5775 Morehouse DriveSan Diego, Cali...