INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "APPARATUS AND METHODS FOR BURST COMMUNICATIONS WITHIN DIE ARCHITECTURES"

GENEVA, March 25 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2024/040060) for "APPARATUS AND METHODS FOR BURST COMMUNICATIONS WITHIN DIE ARCHITECTURES" on Jul 29, 2024. With publication no. WO/2025/058724, the details related to the patent application was published on Mar 20, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SHAH, Parth Saurabhkumar (5775 Morehouse DriveSan Diego, California 92121), GHAZI, Imran (5775 Morehouse DriveSan Diego, California 92121), HARDY, Philip (5775 Moreho...