INTERNATIONAL PATENT: QUALCOMM INCORPORATED, YE, FEIHU, TANG, WEI, HE, HUI, CAO, YAN FILES APPLICATION FOR "DEVICE COMPRISING A HEAT DISSIPATION DEVICE WITH A FLEXIBLE WICK"

GENEVA, Nov. 9 -- QUALCOMM INCORPORATED (attn: International IP Administration, 5775 Morehouse Drive San DiegoCalifornia 92121-1714), YE, Feihu (5775 Morehouse Drive, San DiegoCalifornia 92121-1714), TANG, Wei (5775 Morehouse Drive, San DiegoCalifornia 92121-1714), HE, Hui (5775 Morehouse Drive, San DiegoCalifornia 92121-1714), CAO, Yan (5775 Morehouse Drive, San DiegoCalifornia 92121-1714) filed a patent application (PCT/CN2024/090300) for "DEVICE COMPRISING A HEAT DISSIPATION DEVICE WITH A FLEXIBLE WICK" on Apr 28, 2024. With publication no. WO/2025/227277, the details related to the patent application was published on Nov 06, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, ...