GENEVA, Feb. 15 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse Drive, San DiegoCA 92121-1714), WU, Liangming (5775 Morehouse Drive, San DiegoCA 92121-1714), IVANOV, Kirill (5775 Morehouse Drive, San DiegoCA 92121-1714), LI, Jian (5775 Morehouse Drive, San DiegoCA 92121-1714) filed a patent application (PCT/CN2023/111660) for "INTERLEAVER DESIGN FOR MODULATION WITH POLAR CODES" on Aug 08, 2023. With publication no. WO/2025/030359, the details related to the patent application was published on Feb 13, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): QUALCOMM INCOR...