INTERNATIONAL PATENT: QUALCOMM INCORPORATED, LY, HUNG DINH, XIAO, KEXIN FILES APPLICATION FOR "IMPACT OF CELL DISCONTINUOUS RECEPTION AND HANDOVER ON UPLINK DEMODULATION REFERENCE SIGNAL BUNDLING"

GENEVA, Aug. 17 -- QUALCOMM INCORPORATED (5775 Morehouse Drive, San DiegoCalifornia 92121-1714), LY, Hung Dinh (5775 Morehouse Drive, San DiegoCalifornia 92121-1714), XIAO, Kexin (5775 Morehouse Drive, San DiegoCalifornia 92121-1714) filed a patent application (PCT/CN2024/077125) for "IMPACT OF CELL DISCONTINUOUS RECEPTION AND HANDOVER ON UPLINK DEMODULATION REFERENCE SIGNAL BUNDLING" on Feb 09, 2024. With publication no. WO/2025/166824, the details related to the patent application was published on Aug 14, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): QUALCOMM INCORPORATED (5775 Morehouse...