INTERNATIONAL PATENT: QUALCOMM INCORPORATED, LIU, WEI, WU, LIANGMING, XU, CHANGLONG, JIA, YINHUA, LI, JIAN, XU, HAO FILES APPLICATION FOR "PROBABILISTIC AMPLITUDE SHAPING OVER MULTIPLE DIMENSIONS"

Posted On: 2025-12-15

GENEVA, Dec. 15 -- QUALCOMM INCORPORATED (Attn: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714), LIU, Wei (5775 Morehouse Drive, San DiegoCalifornia 92121-1714), WU, Liangming (5775 Morehouse Drive, San DiegoCalifornia 92121-1714), XU, Changlong (5775 Morehouse Drive, San DiegoCalifornia 92121-1714), JIA, Yinhua (5775 Morehouse Drive, San DiegoCalifornia 92121-1714), LI, Jian (5775 Morehouse Drive, San DiegoCalifornia 92121-1714), XU, Hao (5775 Morehouse Drive, San DiegoCalifornia 92121-1714) filed a patent application (PCT/CN2024/097479) for "PROBABILISTIC AMPLITUDE SHAPING OVER MULTIPLE DIMENSIONS" on Jun 05, 2024. With publication no. WO/2025/251212, the details related to the patent application was p...

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INTERNATIONAL PATENT: QUALCOMM INCORPORATED, LIU, WEI, WU, LIANGMING, XU, CHANGLONG, JIA, YINHUA, LI, JIAN, XU, HAO FILES APPLICATION FOR "PROBABILISTIC AMPLITUDE SHAPING OVER MULTIPLE DIMENSIONS"