INTERNATIONAL PATENT: PSEUDOLITHIC, INC. FILES APPLICATION FOR "MULTI-THICKNESS CHIP INTEGRATION INTO CAVITIES OF A HOST WAFER USING LATERAL DIELECTRIC MATERIAL"

GENEVA, Nov. 25 -- PSEUDOLITHIC, INC. (1114 Corto Camino OntareSanta Barbara, California 93105) filed a patent application (PCT/US2025/025039) for "MULTI-THICKNESS CHIP INTEGRATION INTO CAVITIES OF A HOST WAFER USING LATERAL DIELECTRIC MATERIAL" on Apr 16, 2025. With publication no. WO/2025/240059, the details related to the patent application was published on Nov 20, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HERRAULT, Florian (Agoura Hills, California), SOLDER, Mark (Santa Barbara, California), GREEN, Daniel S. (McLean, Virginia), BUCKWALTER, James F. (Santa Barbara, California)

Abst...