GENEVA, Nov. 25 -- PSEMI CORPORATION (9369 Carroll Park DriveSan Diego, California 92121) filed a patent application (PCT/US2025/026814) for "STRESS DISTRIBUTION FOR WAFER WARPAGE CONTROL" on Apr 29, 2025. With publication no. WO/2025/240113, the details related to the patent application was published on Nov 20, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): NGUYENPHUOC, Thomas (c/o pSemi Corporation9369 Carroll Park DriveSan Diego, California 92121)
Abstract: Methods and devices that reduce wafer warpage in mold-first fan-out wafer-level packaging (FOWLP) processing while not necessarily ...