INTERNATIONAL PATENT: PREGIS LLC FILES APPLICATION FOR "PACKAGING MATERIALS WITH HEAT-ACTIVATED BONDS BETWEEN INTERMITTENT INTER-LAYER ATTACHMENT POINTS"

GENEVA, Oct. 20 -- PREGIS LLC (227 W Monroe Street, Suite 4100Chicago, IL 60606) filed a patent application (PCT/US2025/024431) for "PACKAGING MATERIALS WITH HEAT-ACTIVATED BONDS BETWEEN INTERMITTENT INTER-LAYER ATTACHMENT POINTS" on Apr 11, 2025. With publication no. WO/2025/217618, the details related to the patent application was published on Oct 16, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): WETSCH, Thomas, D. (4833 West BoulevardNaples, FL 34103), SLOVIK, Rachell, L. (236 Weston CourtBartlett, IL 60103)

Abstract: A packaging material includes a first layer having an extensive flat...