INTERNATIONAL PATENT: PREGIS LLC FILES APPLICATION FOR "MULTILAYER EMBOSSMENTS WITH STRAIN-RELIEF FEATURES"

GENEVA, May 15 -- PREGIS LLC (2345 Waukegan Road, Suite 120Bannockburn, IL 60615) filed a patent application (PCT/US2024/054296) for "MULTILAYER EMBOSSMENTS WITH STRAIN-RELIEF FEATURES" on Nov 01, 2024. With publication no. WO/2025/097077, the details related to the patent application was published on May 08, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): WETSCH, Thomas, D. (4833 West BoulevardNaples, FL 34103)

Abstract: Multi-layer packaging articles can include embossments formed on each layer. The packaging articles can be formed from multi layer webs. An embossing device can locally ...