GENEVA, May 15 -- PREGIS LLC (2345 Waukegan Road, Suite 120Bannockburn, IL 60615) filed a patent application (PCT/US2024/054304) for "HEAT-ACTIVATED MULTI-LAYER EMBOSSMENT" on Nov 01, 2024. With publication no. WO/2025/097083, the details related to the patent application was published on May 08, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): WETSCH, Thomas D. (4833 West BoulevardNaples, FL 34103)
Abstract:
Multi-layer packaging articles can include embossments formed on each layer. A bonding element fixes the embossments on one layer to corresponding embossments on another layer. The bo...