INTERNATIONAL PATENT: PRECITEC GMBH & CO. KG FILES APPLICATION FOR "METHOD AND APPARATUS FOR CUTTING A WORKPIECE BY MEANS OF A LASER BEAM"

GENEVA, May 18 -- PRECITEC GMBH & CO. KG (DraisstraBe 176571 Gaggenau) filed a patent application (PCT/EP2024/081493) for "METHOD AND APPARATUS FOR CUTTING A WORKPIECE BY MEANS OF A LASER BEAM" on Nov 07, 2024. With publication no. WO/2025/099150, the details related to the patent application was published on May 15, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HEYERICK, Jan (Warandestraat 839870 Zulte)

Abstract: The present disclosure specifies a method for cutting a workpiece, comprising: forming a perforation by directing the laser beam onto the workpiece, wherein the forming of the...