GENEVA, May 13 -- POINT ENGINEERING CO., LTD. (89, Asanvalley-ro, Dunpo-myeonAsan-SiChungcheongnam-do 31409), (주)포인트엔지니어링 (충청남도아산시둔포면 아산밸리로 89) filed a patent application (PCT/KR2024/016690) for "ATOMIC LAYER DEPOSITION APPARATUS FOR FORMING THIN FILM ON METAL COMPONENT FOR PROCESS CHAMBER" on Oct 29, 2024. With publication no. WO/2025/095543, the details related to the patent application was published on May 08, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property ...