GENEVA, April 19 -- PICOSUN OY (Tietotie 302150 Espoo) filed a patent application (PCT/FI2024/050514) for "SUBSTRATE PROCESSING APPARATUS AND HEATER ELEMENT ASSEMBLY" on Oct 03, 2024. With publication no. WO/2025/078718, the details related to the patent application was published on Apr 17, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): VAHA-OJALA, Timo (c/o Picosun Oy, Masalantie 36502430 Masala), BLOMBERG, Tom (c/o Picosun Oy, Masalantie 36502430 Masala), RIMPILA, Ella (c/o Picosun Oy, Masalantie 36502430 Masala)
Abstract:
A substrate processing apparatus, comprising a reaction chamber...