INTERNATIONAL PATENT: PEXCO AEROSPACE, INC. FILES APPLICATION FOR "THERMOSET SILICONE FILLER, POLYMER COMPOSITIONS CONTAINING THE SAME AND ARTICLES PREPARED THEREFROM"

GENEVA, April 2 -- PEXCO AEROSPACE, INC. (2405 South 3rd AvenueUnion Gap, Washington 98903-1510) filed a patent application (PCT/US2024/047586) for "THERMOSET SILICONE FILLER, POLYMER COMPOSITIONS CONTAINING THE SAME, AND ARTICLES PREPARED THEREFROM" on Sep 20, 2024. With publication no. WO/2025/064742, the details related to the patent application was published on Mar 27, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HOWARD, Chris (c/o Pexco Aerospace, Inc.2405 South 3rd AvenueUnion Gap, Washington 98903-1510), SUBLETT, Don (c/o Pexco Aerospace, Inc.2405 South 3rd AvenueUnion Gap, Washing...