GENEVA, Oct. 13 -- PAUL SCHERRER INSTITUT (Forschungsstrasse 1115232 Villigen PSI), ETH ZURICH (Ramistrasse 101ETH Transfer8092 Zurich) filed a patent application (PCT/EP2025/058820) for "METHODS OF PATTERNING FOR HIGH ASPECT RATIO CATALYST ASSISTED CHEMICAL ETCHING" on Apr 01, 2025. With publication no. WO/2025/210016, the details related to the patent application was published on Oct 09, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): STAMPANONI, Marco (Roosweg 55304 Endingen)
Abstract: Catalyst assisted chemical etching of semiconductor substrate can achieve extreme aspect ratio (better ...