INTERNATIONAL PATENT: PANDUIT CORP. FILES APPLICATION FOR "INTEGRATED LIQUID COOLING MANIFOLD FOR A DATA CENTER CABINET"

GENEVA, Oct. 20 -- PANDUIT CORP. (18900 Panduit DriveTinley Park, Illinois 60487) filed a patent application (PCT/US2025/022231) for "INTEGRATED LIQUID COOLING MANIFOLD FOR A DATA CENTER CABINET" on Mar 31, 2025. With publication no. WO/2025/216902, the details related to the patent application was published on Oct 16, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): BEAUPRE, Eric (18900 Panduit DriveTinley Park, Illinois 60487), CHITTI BABU, Surendra (18900 Panduit DriveTinley Park, Illinois 60487)

Abstract: A data center cabinet having a plurality of front to back members, a first manifold...