INTERNATIONAL PATENT: PANDUIT CORP. FILES APPLICATION FOR "HIGH DENSITY FIBER MANAGEMENT SYSTEM"

GENEVA, June 24 -- PANDUIT CORP. (18900 Panduit DriveTinley Park, Illinois 60487) filed a patent application (PCT/US2024/057230) for "HIGH DENSITY FIBER MANAGEMENT SYSTEM" on Nov 25, 2024. With publication no. WO/2025/128313, the details related to the patent application was published on Jun 19, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KELLY, Brian L. (18900 Panduit DriveTinley Park, Illinois 60487), MARLEY, Kevin A. (18900 Panduit DriveTinley Park, Illinois 60487), WILTJER, Jerry A. (18900 Panduit DriveTinley Park, Illinois 60487), MARCUS, Richard A. (18900 Panduit DriveTinley Park, ...