INTERNATIONAL PATENT: OXWIRES CO., LTD., 옥스와이어즈 주식회사 FILES APPLICATION FOR "CERAMIC-COATED SOLDER BALL, CERAMIC-COATED HEAT DISSIPATION FILLER, SEMICONDUCTOR PACKAGE COMPRISING SAME, SOLDER PASTE AND THERMAL INTERFACE MATERIAL BODY"

GENEVA, March 25 -- OXWIRES CO., LTD. (617, 16 Dosijiwon 1-gil, Godeok-myeon,Pyeongtaek-si,Gyeonggi-do 18021), 옥스와이어즈 주식회사 (경기도평택시고덕면 도시지원1길 16, 617호) filed a patent application (PCT/KR2024/010412) for "CERAMIC-COATED SOLDER BALL, CERAMIC-COATED HEAT DISSIPATION FILLER, SEMICONDUCTOR PACKAGE COMPRISING SAME, SOLDER PASTE, AND THERMAL INTERFACE MATERIAL BODY" on Jul 19, 2024. With publication no. WO/2025/058214, the details related to the patent application was published on Mar 20, 2025.

Notably, the patent application was submitted under the International Patent Class...