INTERNATIONAL PATENT: OWENS CORNING INTELLECTUAL CAPITAL, LLC FILES APPLICATION FOR "PACKAGING SYSTEM"

GENEVA, March 4 -- OWENS CORNING INTELLECTUAL CAPITAL, LLC (One Owens Corning ParkwayToledo, Ohio 43659) filed a patent application (PCT/US2024/043195) for "PACKAGING SYSTEM" on Aug 21, 2024. With publication no. WO/2025/042967, the details related to the patent application was published on Feb 27, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): BRANDT, Luc (Rue de la Vallee, 364841 Henri-Chapelle), DUFRESNE, Elizabeth A. (12 Heron LaneHarpswell, Maine 04079), GRAHAM, John William (13950 Hamby Hill Rd.Frazeysburg, Ohio 43822), POTRONY, Francisco Fernandez (C/ Sant Cristofol, 12-14 -3.3.08243...