GENEVA, Nov. 10 -- ORIGIN COMPANY, LIMITED (3-3-27, Sakawa, Sakura-ku, Saitama-shi, Saitama3380823), 株式会社オリジン (埼玉県さいたま市桜区栄和３丁目３番２７号) filed a patent application (PCT/JP2024/025323) for "BONDING DEVICE AND METHOD FOR PRODUCING BONDED MEMBER" on Jul 12, 2024. With publication no. WO/2025/229768, the details related to the patent application was published on Nov 06, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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