GENEVA, Feb. 17 -- ORBOTECH LTD. (P.O. Box 2158110101 Yavne) filed a patent application (PCT/IB2024/057213) for "THIN FILM THICKNESS ADJUSTMENTS FOR THREE-DIMENSIONAL INTERFEROMETRIC MEASUREMENTS" on Jul 25, 2024. With publication no. WO/2025/032413, the details related to the patent application was published on Feb 13, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): YOAV, Nachum (ORBOTECH LTD.P.O. Box 2158110101 Yavne), LOVSKY LASHCHIVER, Yulia (ORBOTECH LTD.P.O. Box 2158110101 Yavne), RONEN, Levy (ORBOTECH LTD.P.O. Box 2158110101 Yavne)
Abstract:
A 3D surface map of a workpiece is deter...