INTERNATIONAL PATENT: ORBOTECH LTD FILES APPLICATION FOR "THERMAL IMAGING METHOD FOR CRACK AND HOLE DETECTION IN SEMICONDUCTOR DEVICES"

GENEVA, May 12 -- ORBOTECH LTD (Shderot Hasanhedrin 78110101 Yavne) filed a patent application (PCT/IB2024/060799) for "THERMAL IMAGING METHOD FOR CRACK AND HOLE DETECTION IN SEMICONDUCTOR DEVICES" on Nov 01, 2024. With publication no. WO/2025/094123, the details related to the patent application was published on May 08, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): PORAT, Elkana (Simtat HeCharuv 9,7658849 Rehovot), YOGEV, Ronen (Hulda 3377648200 Hulda), TURKO, Nir (Prof. Birk 47608640 Rehovot), PASKOVER, Yuri (32A Seora Street3056017 Binyamina), VAN ROSSEN, Kristiaan (Hoogstraat 433360 Bi...