GENEVA, May 6 -- OHIO STATE INNOVATION FOUNDATION (Energy Advancement and Innovation Center, 2nd floor2281 Kenny RoadColumbus, Ohio 43210) filed a patent application (PCT/US2024/052513) for "HEAT AND PAIN SUPPRESSING COMPOUNDS" on Oct 23, 2024. With publication no. WO/2025/090573, the details related to the patent application was published on May 01, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): PETERSON, Devin (c/o Ohio State Innovation FoundationEnergy Advancement and Innovation Center, 2nd floor2281 Kenny RoadColumbus, Ohio 43210), TELLO CAMACHO, Edisson (c/o Ohio State Innovation Found...